Lead Engineer - PCB Design

What you’ll do:

The Lead PCB Design Engineer is responsible for leading the design, development, and optimization of printed circuit board (PCB) solutions for electronic products. This role ensures high-quality, manufacturable, and reliable PCB designs, drives design standardization and process improvements, provides technical leadership, and collaborates with cross-functional teams to deliver innovative and cost-effective products     

"•    Lead end-to-end PCB development from concept, schematic review, layout, validation, and production release. 
•    Able to lead Program with multiple PCBs and deliver with help of one or more resources 
•    Design complex multi-layer PCBs for:  
-Data center power distribution and management systems 
-Thermal management and cooling control systems 
-Know-how of OCP Rack and its structure 
-Hands-on experience in High Voltage, High Current PCBs 
Develop PCB solutions considering:  
-Signal Integrity (SI) 
-Power Integrity (PI) 
-EMC/EMI compliance 
-Thermal performance 
-Reliability and Manufacturability 
•    Define stack-ups, controlled impedance requirements, high-current power routing, grounding strategies, and power distribution networks. 
•    Collaborate with electrical, mechanical, thermal, firmware, manufacturing, and test teams to optimize overall product performance. 
•    Support design reviews, prototype builds, debugging, root-cause analysis, qualification testing, and certification activities. 
•    Drive PCB design standardization, library management, design automation, and continuous improvement initiatives. 
•    Mentor PCB designers and provide technical leadership across global engineering teams."    

Qualifications:

Required: Bachelor’s Degree in Electronics / Electronics and Communication / Electrical Engineering.

"•    12–14 years of PCB design experience in power electronics or thermal management products.

Skills:

•    Expert knowledge of multi-layer PCB design using Altium Designer, Cadence Allegro, or equivalent EDA tools.

"Required: 
Strong experience in below:  
•     Experience with High Power, Flex, Rigid Flex & HDI PCBS. 
•     High-speed interfaces (DDR, PCIe, Ethernet, USB, SerDes) 
•     Power electronics and power conversion systems 
•     Creepage clearance and safety requirements 
•     SI/PI analysis and simulation 
•     Thermal-aware PCB design 
•     DFM, DFA, and DFT methodologies 

Well versed with Data Center Rack Architectures, including rack-level power distribution, monitoring, control systems, AI/HPC infrastructure, and cooling solutions. 
Good understanding of thermal management technologies including air-cooled and liquid-cooled systems used in modern data centers. 
Able to do Power Integrity or Signal Integrity Simulations will be added advantage 
Standards & Compliance: Strong working knowledge on below:
•     IPC Standards: IPC-2221/2222, IPC-7351, IPC-A-600, IPC-A-610, IPC-6012, IPC-2152 etc. 
•     Safety & Regulatory Standards: UL, CSA, IEC 62368-1, IEC 61010, IEC 60664, CE, EMC/EMI, RoHS, and REACH 
 
Desired: 
•     Experience supporting product certification, safety reviews, and regulatory compliance activities is preferred. .
Special:
•     CAM validation, check and basic editing of Gerber data using CAM350."
"•     Strong leadership, communication, and problem-solving skills. 
•     Ability to work effectively in cross-functional and global engineering environments. "